6-Sided Die Protection for Chiplet Package with Multi-Layer RDL
Author:
Affiliation:
1. nepes hayyim,Binan,Philippines
2. nepes laweh,Cheongan-myeon,Korea
3. nepes corporation,Sandiego,USA
4. Deca Technologies,Tempe,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195722.pdf?arnumber=10195722
Reference6 articles.
1. Fan-Out Packaging Market and Trends;favier;Yole Developpement,2020
2. Innovative Package-on-Package Solution: M-Series™ Fan-Out (mPoP);kim;IMAPS,2021
3. Adaptive Patterning for Panelized Packaging;scanlan;IWLPC Proceedings,0
4. 600mm FOPLP As a Scale Up Alternative to 300mm FOWLP with 6-Sided Molded Die Protection;aman lim;ECTC,2021
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06
2. Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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