Author:
Pfost Martin,Boianceanu Cristian,Lohmeyer Henning,Stecher Matthias
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
40 articles.
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1. A Split-Gate Power MOSFET Obtaining Ultra-Wide SOA Based on Time-Shared and Partitioned Conduction Gate Control;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-04
2. A Machine Learning Model for the Detection of Solder Voids with Adjacent Sensors;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08
4. Efficient Simulation of the Effect of Solder Voids and Tilting on the Cooling of Power Semiconductors;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
5. A Double-Threshold Over-Temperature Protection Circuit for Smart Power ICs;2022 7th International Conference on Integrated Circuits and Microsystems (ICICM);2022-10-28