Simulation of interface thermal properties and optimization methods of Al<sub>2</sub>O<sub>3</sub>/ EP composites-Reference-Cited by-同舟云学术

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Simulation of interface thermal properties and optimization methods of Al₂O₃/ EP composites

Published:2022-10-30 Issue: Volume: Page:
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Container-title:2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
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Author:

Xue Xiaofeng¹,Song Xupeng¹,Liu Xin²,Wang Liufang³,Guo Zhenyu³,Shi Wen³,Bian Xingming¹

Affiliation:

1. North China Electric Power University,State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources,Beijing,P.R.China,102206

2. State Grid Anhui Electric Power Corporation, Limited.,No.9 Huangshan Road,Baohe District,Hefei, Anhui,China,230000

3. State Grid Anhui Ultra High Voltage Company,No.397, Tongcheng South Road,Baohe District,Hefei, Anhui,China,230000.

Funder

Science and Technology Project of State Grid

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9985012/9985245/09985369.pdf?arnumber=9985369

Reference9 articles.

1. Thermal stability of polyphenylsilsesquioxane‐modified meta‐aramid insulation paper

2. Analysis of Three-Phase Structure of Epoxy Resin/CNT/Graphene by Molecular Simulation

3. Static dielectric constant and dielectric loss of cellulose insulation: Molecular dynamics simulations

4. Molecule diffusion behaviours of waterproof sealants into silicone rubber insulation for submarine cable joint based on molecular dynamics simulations

5. Analysis of Three-Phase Structure of Epoxy Resin/CNT/Graphene by Molecular Simulation

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