Study on the Effects of Organic Bonding Agent and Low-Temperature Glass Solder Process on the Performance of Compact Packaged Fiber Optic Temperature Sensors-Reference-Cited by-同舟云学术

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Study on the Effects of Organic Bonding Agent and Low-Temperature Glass Solder Process on the Performance of Compact Packaged Fiber Optic Temperature Sensors

Published:2024-06-15 Issue:12 Volume:24 Page:19202-19209
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Li Chengfei¹,Tong Xinglin²^ORCID,Huang Wenzhong²,Zeng Fanchao²,Wang Yuhan²,Shi Xuefeng²,Chen Long²,Zeng Chuan²

Affiliation:

1. National Engineering Laboratory for Fiber Optic Sensing Technology and the School of Mechanical and Electronic Engineering, Wuhan University of Technology, Wuhan, China

2. National Engineering Laboratory for Fiber Optic Sensing Technology, Wuhan University of Technology, Wuhan, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/7361/10558706/10517342.pdf?arnumber=10517342

Reference27 articles.

1. Temperature and external strain sensing with metal-embedded optical fiber sensors for structural health monitoring

2. Strain transfer theory of industrialized optical fiber-based sensors in civil engineering: A review on measurement accuracy, design and calibration

3. High-Temperature Profile Monitoring in Gas Turbine Exhaust-Gas Diffusors with Six-Point Fiber-Optic Sensor Array

4. FBG Sensors for Environmental and Biochemical Applications—A Review

5. Structural Health Monitoring for Bridge Crane Based on Low Temperature-Sensitivity FBG Sensors

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