Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor With Back-Inlet Package Structure-Reference-Cited by-同舟云学术

Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor With Back-Inlet Package Structure

Published:2024-08-15 Issue:16 Volume:24 Page:25476-25485
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Huang Mimi¹^ORCID,Han Xiangguang²^ORCID,Zhao Libo²^ORCID,Fan Shu³^ORCID,Xia Yong²,Qiao Zhixia⁴,Li Wei⁴,Gao Yi¹,Yang Ping²,Chen Shuai¹,Cui Zeyu²,Zhang Cheng¹,Li Zhikang²^ORCID,Hou Xiaowei⁵

Affiliation:

1. School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an, China

2. School of Instrument Science and Technology, Xi’an Jiaotong University, Xi’an, China

3. 210th Institute of the Sixth Academy, CASIC, Xi’an, China

4. Xi’an Aerospace Yuanzheng Fluid Control Company Ltd., Xi’an, China

5. Ningbo CRRC Times Transducer Technology Company Ltd., Ningbo, China

Funder

National Key Research and Development Plan

Youth Fund of the National Natural Science Foundation of China

Shaanxi Provincial Key Research and Development Program “Two Chains” Integration Enterprises (Institutes) Joint Key Special Project

Natural Science Foundation of Shaanxi

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/7361/10637303/10599133.pdf?arnumber=10599133

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