Multiscale Integrated Temperature/Flow Velocity Sensor Patches for Microfluidic Applications-Reference-Cited by-同舟云学术

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Multiscale Integrated Temperature/Flow Velocity Sensor Patches for Microfluidic Applications

Published:2023-02-01 Issue:3 Volume:23 Page:1795-1802
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Shen Yigang¹^ORCID,Yuan Yapeng²,Liu Xun³,Tang Tao³,Yalikun Yaxiaer³,Tanaka Yo⁴

Affiliation:

1. College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, China

2. Graduate School of Frontier Biosciences, Osaka University, Suita, Japan

3. Graduate School, Nara Institute of Science and Technology, Nara, Japan

4. Center for Biosystems Dynamics Research, RIKEN, Osaka, Japan

Funder

Japan Society for the Promotion of Science (JSPS) through the Grants-in-Aid for Scientific Research on Innovative Areas

RIKEN Junior Research Associate Program, Japan

Tokyo Electric Power Company (TEPCO) Memorial Foundation

Amada Foundation

Nippon Sheet Glass (NSG) Foundation of Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/10032973/09998493.pdf?arnumber=9998493

Reference45 articles.

1. Microscopic impedance cytometry for quantifying single cell shape

2. CdSe/ZnS quantum dot fluorescence spectra shape-based thermometry via neural network reconstruction

3. Detection principles and development of microfluidic sensors in the last decade

4. Simulation and optimization of a microfluidic flow sensor

5. An infrared sensor system for the analysis and differentiation of living mammalian cells using D2O based microfluidics

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1. Recent Advances in Transparent Electrodes and Their Multimodal Sensing Applications;Advanced Science;2024-08-09

2. Printed Optical Waveguide Temperature Sensor With Rhodamine-Doped Core;IEEE Sensors Letters;2024-08

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4. A fully printed sensor with optical readout for real-time flow monitoring;Flexible and Printed Electronics;2023-12-01

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