Response Optimization of LiNbO3 Ultrasonic Transducers for High Temperature Measurement

Author:

Zeng Xiaomei1,Pelenovich Vasiliy O.2ORCID,Zhang Xiangyu3,Xu Chang2,Ding Yue4,Wang Zheng4,Chen Zhiwen5,Zhang Jun3,Yang Bing3,Pogrebnjak Alexander6,Liu Sheng5

Affiliation:

1. Institute of Technological Sciences and the School of Power and Mechanical Engineering, Wuhan University, Wuhan, China

2. Institute of Technological Sciences, Wuhan University, Wuhan, China

3. School of Power and Mechanical Engineering, Wuhan University, Wuhan, China

4. Beijing Smartchip Microelectronics Technology Company Ltd., Beijing, China

5. Institute of Technological Sciences and the Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan, China

6. Faculty of Electronics and Information Technology, Sumy State University, Sumy, Ukraine

Funder

Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration

Hubei Provincial and Municipal Double First-Class Talent Construction Startup Fund in 2023

Key Research and Development Program of Hubei Province

Smartcore Research Program of Chinese Institute of Electronics

EU NextGenerationEU through the Recovery and Resilience Plan for Slovakia

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

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