AgPd Thin-Film Strain Gauges Fabricated by Direct Writing for High-Temperature Application
Author:
Affiliation:
1. Department of Mechanical and Electrical Engineering, School of Aerospace Engineering, Xiamen University, Xiamen, China
Funder
National Natural Science Foundation of China
China Aviation Research Institute, Shenyang Engine Design and Research Institute
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/7361/9966666/09933369.pdf?arnumber=9933369
Reference27 articles.
1. Three-dimensional stress analysis and design of cross-laminated timber panels using full-layerwise-theory-based finite element method
2. Vibration Analysis of Aeroengine Compressor Blade-Disc Coupling System
3. TiB 2 ‐Modified Polymer‐Derived Ceramic SiCN Double‐Layer Thin Films Fabricated by Direct Writing for High‐Temperature Application
4. A robust pressure sensor for harsh environmental applications
5. Strain sensitivity of TiB2, TiSi2, TaSi2 and WSi2 thin films as possible candidates for high temperature strain gauges
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4. Combining 3-D Printing and Magnetron Sputtering Technique for Fabricating High-Temperature AgPd Thick Film Strain Gauge;IEEE Sensors Journal;2023-12-01
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