Mechanical Neutral Plane Modulation in Polymer Flexible Multilayer Substrate for Ultrastable Sensor Fabrication-Reference-Cited by-同舟云学术

Mechanical Neutral Plane Modulation in Polymer Flexible Multilayer Substrate for Ultrastable Sensor Fabrication

Published:2023-10-15 Issue:20 Volume:23 Page:24231-24238
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Tripathy Kamalesh¹^ORCID,Bhattacharjee Mitradip²^ORCID

Affiliation:

1. Department of Electrical Engineering and Computer Science, Indian Institute of Science Education and Research Bhopal, Bhopal, India

2. Electrical Engineering and Computer Science Department and the i-Lab Research Group, Indian Institute of Science Education and Research Bhopal, Bhopal, India

Funder

SERB SUPRA through Government of India

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/10286142/10250816.pdf?arnumber=10250816

Reference34 articles.

1. Mechanics of finger-tip electronics

2. Mechanical durability of RFID chip joints assembled on flexible substrates

3. Crosslinking effect on polydimethylsiloxane elastic modulus measured by custom-built compression instrument

4. Mechanical analysis of the damage of a thin polymeric coating during scratching: role of the ratio of the coating thickness to the roughness of a scratching tip

5. Adhesion Measurement of Thin Films

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