Simulation and Optimization of Surface Acoustic Wave Devices With High Electromechanical Coupling Factor and Zero Temperature Coupling Coefficient by Pattern Piezoelectric Layer

Author:

Dun Hongyu1,Han Xu1,Wang Fang1ORCID,Nie Weican1,Yang Zuodong1,Zhou Lintao1,Zhang Fengpu1,Sun Han1,Han Yemei1,Kong Deqing2,Zhang Kailiang1ORCID

Affiliation:

1. Tianjin Key Laboratory of Film Electronic and Communication Devices, School of Integrated Circuit Science and Engineering, Tianjin University of Technology, Tianjin, China

2. Muroran Institute of Technology, Hokkaido, Muroran, Japan

Funder

Science and Technology Planning Project of Tianjin City

Research and Development Program in Significant Area of Guangdong Province

Tianjin University of Science and Technology 2022 University-Level Postgraduate Research Innovation Practice Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

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