Mathematical Model and Experimental Characterization of Vertically Stacked Capacitive Tactile Sensors
Author:
Affiliation:
1. Mechatronics and Automatic Control Laboratory, University of Genoa, Genoa, Italy
2. Department of Mechanical Engineering (DIME), University of Genoa, Genoa, Italy
3. Oxford Robotics Institute, Oxford, U.K
Funder
European Union’s Horizon Europe Project “Sestosenso”
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/7361/10251409/10209412.pdf?arnumber=10209412
Reference36 articles.
1. Fabrication of multi-layer vertically stacked fused silica microsystems
2. Modeling and analysis of vias in multilayered integrated circuits
3. Vertically stacked capacitive tactile sensor with more than quadrupled spatial resolution enhancement from planar arrangement
4. Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics
5. Vertically Integrated Multiple Electrode Design for Sensitivity Enhancement of CMOS-MEMS Capacitive Tactile Sensor
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1. A new strategy for fabricating a stacked flexible capacitive sensor;Functional Composite Materials;2024-07-24
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