On-Chip Metal Tiling for Improving Grounded mm-Wave Antenna-on-Chip Performance in Standard Low-Cost Packaging
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/8/9058732/08930583.pdf?arnumber=8930583
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Probe-Fed Millimeter-Wave and Subterahertz Antenna Measurements: Challenges and solutions;IEEE Antennas and Propagation Magazine;2024-08
2. Gain Enhancement of Antenna-on-Chip at 94 GHz with an Integrated Artificial Magnetic Conductor for 6G System-on-Chip;2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC);2023-10-16
3. Design and Optimization of a GaAs Millimeter-Wave On-Chip Patch Antenna;2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI);2023-07-23
4. A 0.18 μm CMOS Millimeter Wave Antenna-on-Chip with Artificial Magnetic Conductor Design;Inventions;2023-06-02
5. Improving the Performance of Antenna-on-Chip by Effectively Illuminating the Artificial Magnetic Conductors Through Coupling Enhancement Structures;IEEE Transactions on Antennas and Propagation;2023-05
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