External PCB temperature regulation during a bed-of-nails testing method based on environment and near-processor temperature measurements-Reference-Cited by-同舟云学术

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External PCB temperature regulation during a bed-of-nails testing method based on environment and near-processor temperature measurements

Published:2022-05-25 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Zooming Innovation in Consumer Technologies Conference (ZINC)
language:
Short-container-title:

Author:

Piskac Tibor¹,Herceg Marijan²,Marinkovic Vladimir³,Teslic Nikola⁴

Affiliation:

1. TTTech Auto CEE Osijek,Osijek,Croatia

2. Computer Science and Information Technology,Faculty of Electrical Engineering,Osijek,Croatia

3. RT-RK Institute for Computer Based Systems,Novi Sad,Serbia

4. University of Novi Sad,Faculty of Technical Sciences,Novi Sad,Serbia

Funder

Ministry of Education, Science and Technological Development of the Republic of Serbia

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9840523/9840527/09840690.pdf?arnumber=9840690

Reference13 articles.

1. Pull-up Resistor and Pull-down Resistor Explained;Electronic Tutorials,0

2. The Linux Kernel Module Programming Guide, 2.6.4;salzman;The Linux Documentation Project,2007

3. Device Tree for Dummies;petazzoni,0

4. A neuro-fuzzy fan speed controller for dynamic management of processor fan power consumption

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