A Temperature Monitoring Method for Press Pack IGBT Based on Digital Twin-Reference-Cited by-同舟云学术

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A Temperature Monitoring Method for Press Pack IGBT Based on Digital Twin

Published:2022-11-04 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC)
language:
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Author:

Zhou Bailing¹,Li Hui¹,Lai Wei¹,Yao Ran¹

Affiliation:

1. Chongqing University,State Key Laboratory of Power Transmission Equipment & System Security and New Technology,Chongqing,China

Funder

National Natural Science Foundation of China

State Grid Corporation of China

Fundamental Research Funds for the Central Universities

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9958944/9959090/09959546.pdf?arnumber=9959546

Reference10 articles.

1. Temperature Distribution Evaluation of Single Chip by Multiple Currents V CE (T) Method

2. Optimization on Thermomechanical Behavior for Improving the Reliability of Press Pack IGBT Using Response Surface Method

3. The Time-Domain Vector Fitting Algorithm for Linear Macromodeling

4. Pressure-dependent thermal network for press-pack power module with prognostics of mechanical status;chang;CSEE Journal of Power and Energy Systems,0

5. Reengineering Aircraft Structural Life Prediction Using a Digital Twin

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Online Evaluation of Fretting Wear Aging Status of Press-Pack IGBT Device;2023 IEEE Sustainable Power and Energy Conference (iSPEC);2023-11-28

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