Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect
Author:
Affiliation:
1. Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany
Funder
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10198027/10198028/10198099.pdf?arnumber=10198099
Reference11 articles.
1. Design and Optimization of a 130-GHz Wire Bond Interconnection
2. Bondwire impedance compensation using a series transmission line section
3. Differential bondwire interface for chip-to-chip and chip-to-antenna interconnect above 200 GHz
4. Wide-bandwidth millimeter-wave bond-wire interconnects
5. Investigation of the capacitance compensation structure for wire-bonding interconnection in multi-chips module
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