Modular Probecard-Measurement Equipment for Automated Wafer-Level Characterization of High Precision MEMS Gyroscopes-Reference-Cited by-同舟云学术

Modular Probecard-Measurement Equipment for Automated Wafer-Level Characterization of High Precision MEMS Gyroscopes

Published:2022-05-08 Issue: Volume: Page:
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Container-title:2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)
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Author:

Weidlich Sebastian¹,Forke Roman²,Hiller Karla²,Bulz Daniel¹,Shaporin Alexey¹,Kuhn Harald²

Affiliation:

1. Chemnitz University of Technology,Center for Microtechnologies,Chemnitz,Germany

2. Fraunhofer ENAS,Chemnitz,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9787684/9787697/09787750.pdf?arnumber=9787750

Reference7 articles.

1. Electrostatic stiffness correction for quadrature error in decoupled dual-mass MEMS gyroscope;hongsheng;Journal of Micro/Nanolithography MEMS and MOEMS,2014

2. Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen;weidlich;Mikro-systemtechnik Kongress,2015

3. North finding with a single double mass MEMS gyroscope- A performance demonstrator

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