MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements
Author:
Affiliation:
1. Technology and Research (A*STAR),Institute of Microeletronics, Agency for Science,Singapore
2. Cornell University,SonicMEMS Laboratory, School of Electrical and Computer Engineering,Ithaca,NY,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10272029/10272034/10272103.pdf?arnumber=10272103
Reference7 articles.
1. A study of bonding materials for ghz ultrasonic wavefront computing;chen;2022 IEEE International Ultrasonics Symposium (IUS),2022
2. GHz Ultrasonic Digital to Analog Converter for Wavefront Signal Processing
3. An On-Chip 2-D DFT Accelerator Ultrasonic Wavefront for Convolutional Neural Networks
4. Investigation of Au-AuSn Bonding Below Eutectic Temperature for Gigahertz Bulk Acoustic Wave Transmission
5. Planar GHz Ultrasonic Lens for Fourier Ultrasonics
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1. Analysis Of Crosstalk in Binary Weighted Bulk Acoustic Wave Transducers For Ultrasonic Based Fourier Transform Accelerators;2023 IEEE International Ultrasonics Symposium (IUS);2023-09-03
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