Insulation State Assessment of Press-Pack IGBTs Based on Electric and Temperature Field Simulation
Author:
Affiliation:
1. College of Electronic and Information Engineering, Tongji University,Department of Electrical Engineering,Shanghai,China
Funder
NSFC
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10613003/10613009/10613040.pdf?arnumber=10613040
Reference12 articles.
1. Study of the electrical insulation of press pack IGBT: problems and methodologies;Fu;Power Electronics,2018
2. Study on the issue of electric field concentration in submodule of press pack IGBTs
3. Influence analysis of packaging on electric field of chip in elastic press-pack IGBT device;Liu,2023
4. Thermal and Structural Simulation Techniques for Estimating Fatigue Life of an IGBT Module
5. Research on IGBT bonding wire failure analysis and health status assessment;Li;Southwest Jiaotong University,2022
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