Sn–Ag–Cu Solder Reflow-Capable 28-Gb/s × 4-Channel High-Density Parallel-Optical Modules
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/50/6674073/06648653.pdf?arnumber=6648653
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. >1.3-Tb/s VCSEL-Based On-Board Parallel-Optical Transceiver Module for High-Density Optical Interconnects;Journal of Lightwave Technology;2018-01-15
2. Recent Advances and Prospects in the Packaging Architecture for Optical Interconnection;Journal of Japan Institute of Electronics Packaging;2017
3. Polymer Waveguide-Coupled Solderable Optical Modules for High-Density Optical Interconnects;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05
4. 1060-nm 28-Gb/s $\times 4$ -Channel Modules Operated Over the Case Temperature Range;IEEE Photonics Technology Letters;2015-12-01
5. 1060-nm VCSEL-based parallel-optical modules for optical interconnects;SPIE Proceedings;2015-04-03
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