Cu wire and beyond - Ag wire an alternative to Cu?
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5685177/5702594/05702707.pdf?arnumber=5702707
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials;Journal of Materials Science: Materials in Electronics;2021-10-05
2. Detecting the Internal Distribution and Structure of Pd-Doped Ag Wire Bonds Using an RF Technique;Journal of Electronic Materials;2018-09-19
3. Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
4. An Evaluation of Effects of Molding Compound Properties on the Reliability of Ag Wire Bonded Components;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05
5. Correlation Study of Pd Metallurgical Distributions and RF Characteristics of Pd Coated/Doped Ag-Alloy Wire Bonds;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05
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