1. A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
2. Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision;marinins;IEEE Journal of Selected Topics in Quantum Electronics,2023
3. Self-Aligned Silicon Interposer Tiles and Silicon Bridges Using Positive Self-Alignment Structures and Rematable Me-chanically Flexible Interconnects;yang;IEEE Transactions on Components Packaging and Manufacturing Technology,2014
4. High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating; High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating;rajan;2019 International 3D Systems Integration Conference (3DIC),0
5. A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing 10-dB Gain;fuad;2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ECTC,0