Ultrasensitive and low-cost insole for gait analysis using piezoelectrets-Reference-Cited by-同舟云学术

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Ultrasensitive and low-cost insole for gait analysis using piezoelectrets

Published:2022-10-30 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Sensors
language:
Short-container-title:

Author:

Ben Dali Omar¹,Sellami Youssef¹,Zhukov Sergey²,von Seggern Heinz²,Schafer Niklas¹,Latsch Bastian¹,Sessler Gerhard M.¹,Beckerle Philipp³,Kupnik Mario¹

Affiliation:

1. Measurement and Sensor Technology, Technical University of Darmstadt,Germany

2. Electronic Materials, Technical University of Darmstadt,Germany

3. Chair of Autonomous Systems and Mechatronics, Friedrich-Alexander-University Erlangen-Nuremberg,Germany

Funder

Deutsche Forschungsgemeinschaft

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9966996/9966997/09967198.pdf?arnumber=9967198

Reference28 articles.

1. Piezoelectrets from thermo-formed bubble structures of fluoropolymer-electret films

2. Template-based fluoroethylenepropylene piezoelectrets with tubular channels for transducer applications

3. Polarization and piezoelectricity in polymer films with artificial void structure

4. Tubular fluoropolymer arrays with high piezoelectric response

5. High performance fluorinated polyethylene propylene ferroelectrets with an air-filled parallel-tunnel structure

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Force Myography for Motion Intention Detection Based on 3D-Printed Piezoelectric Sensors;IEEE Sensors Letters;2024-09

2. 3D-Printed Piezoelectric PLA-Based Insole for Event Detection in Gait Analysis;IEEE Sensors Journal;2024-08-15

3. Hybrid Sensor Insole for Wearable Ballistocardiography in Remote Health Monitoring;2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2024-06-30

4. Recent Advances in Ferroelectret Fabrication, Performance Optimization, and Applications;Advanced Materials;2024-05-28

5. Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films;2023 IEEE SENSORS;2023-10-29

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