Initial Investigation of Physically Tightly-Coupled Single-Chip MEMS IMU for Mutual Compensation of Two Differential Resonant Accelerometers and a Mode-Matched Donut-Mass Gyroscope-Reference-Cited by-同舟云学术

Initial Investigation of Physically Tightly-Coupled Single-Chip MEMS IMU for Mutual Compensation of Two Differential Resonant Accelerometers and a Mode-Matched Donut-Mass Gyroscope

Published:2023-10-29 Issue: Volume: Page:
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Container-title:2023 IEEE SENSORS
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Author:

Miyazaki Fumito¹,Ono Daiki¹,Ogawa Jumpei¹,Tomioka Tazuko¹,Masunishi Kei¹,Uchida Kengo¹,Murase Hideaki¹,Ogawa Etsuji¹,Ishibashi Fumitaka¹,Tomizawa Yasushi¹

Affiliation:

1. Corporate Research & Development Center, Toshiba Corporation,Kawasaki,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10324456/10324848/10325017.pdf?arnumber=10325017

Reference7 articles.

1. Vibratory gyro analysis by the method of averaging;lynch;Proc 2nd St Petersburg Int Conf on Gyroscopic Tech and Navigation,1995

2. A T-Shaped Mems Differential Resonant Accelerometer with Module-Base Demonstration of >134 Db Dynamic Range and <1 Mdeg Absolute Tilt Angle Precision

3. Environmentally robust differential resonant accelerometer in a wafer-scale encapsulation process

4. A <100 PPB/K Frequency-Matching Temperature Stability MEMS Rate Integrating Gyroscope Enabled by Donut-Mass Structure

5. A 0.1 DEG/H Module-Level Silicon Mems Rate Integrating Gyroscope Using Virtually Rotated Donut-Mass Structure and Demonstration of the Earth's Rotation Detection

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1. Demonstration of Multi-axis Sensitivity and Temperature Compensation for a Physically Tightly-Coupled MEMS IMU Integrating a Mode-Matched Gyroscope and Two Differential Resonant Accelerometers;2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL);2024-03-25