Low-Bow Glass-Si Anodic Wafer Bonding at High Temperature by Means of CTE Engineering of Corning Novel Fusion Glass
Author:
Affiliation:
1. SUSS MicroTec Solutions GmbH & Co. KG, Application Center Bonding Systems,Sternenfels,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10324456/10324848/10324950.pdf?arnumber=10324950
Reference11 articles.
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3. Low cost anodic bonding for MEMS packaging applications;k s h s s v;Microsystem Technologies,2014
4. Low temperature wafer bonding for MEMS processes and 3D integration
5. Semiconductor wafer bonding: recent developments
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