A new polyimide film for VLSI and its electrical characterization
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx4/94/14783/00671967.pdf?arnumber=671967
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Surface charge coupling behavior of fluorinated polyimide film under DC and pulse voltage;IEEE Transactions on Dielectrics and Electrical Insulation;2017-02
2. Effect of plasma deposited thin carbon layer on dielectric characteristics of Au-PI-Au structures;IEEE Transactions on Dielectrics and Electrical Insulation;2012-12
3. Investigations on high temperature polyimide potentialities for silicon carbide power device passivation;Microelectronic Engineering;2006-01
4. Analysis of the insulation capability of polyester insulator;Journal of the Franklin Institute;2005-05
5. Polyimides for Microelectronics and Tribology Applications;Supramolecular Photosensitive and Electroactive Materials;2001
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