Ti-Containing Cu<sub>3</sub>N Nanostructure Thin Films: Experiment and Simulation on Reactive Magnetron Sputter-Assisted Nitridation-Reference-Cited by-同舟云学术

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Ti-Containing Cu₃N Nanostructure Thin Films: Experiment and Simulation on Reactive Magnetron Sputter-Assisted Nitridation

Published:2015-06 Issue:6 Volume:43 Page:1969-1973
ISSN:0093-3813
Container-title:IEEE Transactions on Plasma Science
language:
Short-container-title:IEEE Trans. Plasma Sci.

Author:

Rahmati Ali

Funder

Iranian Nanotechnology Initiative

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Condensed Matter Physics,Nuclear and High Energy Physics

Link

http://xplorestaging.ieee.org/ielx7/27/7118793/07119656.pdf?arnumber=7119656

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surveying the Synthesis, Optical Properties and Photocatalytic Activity of Cu3N Nanomaterials;Nanomaterials;2022-06-28

2. Structure and electrical transport properties of Pb-doped copper nitride (Cu3N:Pb) films;Vacuum;2019-06

3. Preparation, structure, properties, and application of copper nitride (Cu 3 N) thin films: A review;Journal of Materials Science & Technology;2018-09

4. Negative permittivity and permeability of gold nanostructured thin films in UV–vis region;Journal of Nanophotonics;2018-07-26

5. The Effect of Substrate on Structural and Electrical Properties of Cu3N Thin Film by DC Reactive Magnetron Sputtering;PHYS CHEM RES;2017

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