Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation-Reference-Cited by-同舟云学术

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Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

Published:2002-03 Issue:1 Volume:25 Page:87-97
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Hutt D.A.,Liu C.,Conway P.P.,Whalley D.C.,Mannan S.H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/21371/00991180.pdf?arnumber=991180

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