Power Semiconductor Module With Low-Permittivity Material to Reduce Common-Mode Electromagnetic Interference-Reference-Cited by-同舟云学术

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Power Semiconductor Module With Low-Permittivity Material to Reduce Common-Mode Electromagnetic Interference

Published:2018-12 Issue:12 Volume:33 Page:10027-10031
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Shin Jong-Won^ORCID,Wang Chi-Ming,Dede Ercan M.^ORCID

Funder

Toyota Motor Engineering and Manufacturing North America

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/8468129/08340175.pdf?arnumber=8340175

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15

2. EMI Filter Integration for GaN Power Module Using Air-Cured Magnetic Composite;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

3. Simple Experimental Characterization of Switching Node Parasitic in Half Bridge Module and Device;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

4. Thermal Performance Comparisons of Different Spacer Structures in Double-Sided Cooling Power Modules;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

5. Integrated Common-Mode Filter for GaN Power Module With Improved High-Frequency EMI Performance;IEEE Transactions on Power Electronics;2023-06

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