Author:
van Tongeren H.,Kokkelink J.W.,Tjassens H.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Cited by
2 articles.
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1. Frequency Bandwidth Estimation of TO Packaging Techniques for Laser Modules;Optical and Quantum Electronics;2005-08
2. Microwave packaging of high - speed semiconductor lasers;Integrated Photonics Research and Applications/Nanophotonics for Information Systems;2005