Author:
Rowell David R.,Wood Joshua D,Stender Christopher L.,Chan Ray,Wibowo Andree,Osowski Mark,Pan Noren
Cited by
1 articles.
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1. Contact Resistance of 3D-Printed Interconnects to Thin-Film Metals for Advanced Packaging;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15