Interpretation of Device Characteristics of Wide-Width InGaZnO Transistors for Gate Driver Circuits
Author:
Affiliation:
1. Department of Electrical and Electronic Engineering, Hanyang University, Ansan, South Korea
2. IT Development Team, Samsung Display Inc., Yongin, South Korea
3. Research and Development Center, Samsung Display Inc., Yongin, South Korea
Funder
Samsung Display Company
National Research Foundation of Korea
Ministry of Science and ICT
IC Design Education Center
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/10265125/10224529.pdf?arnumber=10224529
Reference18 articles.
1. Amorphous IGZO TFTs Featuring Extremely-Scaled Channel Thickness and 38 nm Channel Length: Achieving Record High Gm,max of 125 μS/μm at VDS of 1 V and ION of 350 μA/μm
2. Submicrometer Top-Gate Self-Aligned a-IGZO TFTs by Substrate Conformal Imprint Lithography
3. MOSFET channel length: extraction and interpretation
4. Scaling behaviour of a-IGZO TFTs with transparent a-IZO source/drain electrodes
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