A Low-Loss Bandpass Filter With Stacked Double-Layer Structure Using Glass-Based Integrated Passive Device Technology
Author:
Affiliation:
1. School of Electronic Science and Engineering, Xiamen University, Xiamen, China
Funder
National Natural Science Foundation of China
Science and Technology Major Project of Xiamen City
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/10168002/10122991.pdf?arnumber=10122991
Reference16 articles.
1. An On-Chip Ultra-Wideband Bandpass Filter in 0.18-μm SiGe BiCMOS Technology
2. Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules
3. Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate
4. Compact On-Chip Bandpass Filter With Improved In-Band Flatness and Stopband Attenuation in 0.13- $\mu \text{m}$ (Bi)-CMOS Technology
5. Miniaturized Ultra-Wideband Bandpass Filter Using Bridged-T Coil
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