A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer-Reference-Cited by-同舟云学术

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A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer

Published:2023-03 Issue:3 Volume:44 Page:504-507
ISSN:0741-3106
Container-title:IEEE Electron Device Letters
language:
Short-container-title:IEEE Electron Device Lett.

Author:

Yao Yuan¹^ORCID,Qiu Xing²^ORCID,Cheng Yuanjie³^ORCID,Lo Jeffery C. C.⁴^ORCID,Lee S. W. Ricky⁵^ORCID,Ki Wing-Hung¹^ORCID,Tsui Chi-Ying¹^ORCID

Affiliation:

1. Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, New Territories, Hong Kong

2. HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute, Futian, China

3. Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, New Territories, Hong Kong

4. HKUST Foshan Research Institute for Smart Manufacturing, Kowloon, Hong Kong

5. HKUST LED-FPD Technology R&D Center, Foshan, China

Funder

Hong Kong Innovation and Technology Fund

Project of Hetao Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/55/10053585/10032542.pdf?arnumber=10032542

Reference15 articles.

1. A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging

2. Efficient wireless power transmission technology based on above-CMOS integrated (ACI) high quality inductors

3. An improved de-embedding technique for on-wafer high-frequency characterization

4. Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

5. Silicon-Embedded Receiving Coil for High-Efficiency Wireless Power Transfer to Implantable Biomedical ICs

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