Power Cycling and Research on Failure Mechanism of Press-Pack IGBT based on Thermal Resistance Composition Testing-Reference-Cited by-同舟云学术

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Power Cycling and Research on Failure Mechanism of Press-Pack IGBT based on Thermal Resistance Composition Testing

Published:2024-06-12 Issue: Volume: Page:15-18
ISSN:
Container-title:2024 4th International Conference on Electronic Materials and Information Engineering (EMIE)
language:
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Author:

Zhang Boyang¹,Feng Shiwei¹,He Xin²,Bai Kun¹,Lu Xiaozhuang¹,Zhou Yinqi¹

Affiliation:

1. Beijing University of Technology,Chaoyang District,Beijing,China

2. State Grid Electric Power Research Institute,Nanjing,China

Funder

Research and Development

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10616391/10616407/10617102.pdf?arnumber=10617102

Reference10 articles.

1. Design and Operation of a Medium Voltage Pulse Test Apparatus for Short-Circuit Testing of DC Solid State Circuit Breakers

2. Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

3. IGBT technology for future high-power vsc-hvdc applications

4. Solid-State Transformers of Smart High-Power Battery Charger for Electric Vehicles

5. FEM Simulation and Lifetime Prediction of Press-Pack IGBT: A Review

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