Rapid Surface Oxidation of the Si Substrate Using Longitudinally Long Ar/O2Loop Type of Inductively Coupled Thermal Plasmas
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Condensed Matter Physics,Nuclear and High Energy Physics
Link
http://xplorestaging.ieee.org/ielx7/27/7762697/07563848.pdf?arnumber=7563848
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Recent development of new inductively coupled thermal plasmas for materials processing;Advances in Physics: X;2021-01-01
2. Three-Dimensional Two-Temperature Modeling of Ar Loop-Type Inductively Coupled Thermal Plasma for Surface Modification;Plasma Chemistry and Plasma Processing;2020-11-28
3. Numerical thermofluid simulation on tandem type of induction thermal plasmas with and without current modulation in a lower coil;Journal of Physics D: Applied Physics;2020-02-18
4. Review of Thermal Plasma Simulation Technique;IEEJ Transactions on Electrical and Electronic Engineering;2019-10-27
5. Effects of the Driving Frequency on Temperature in a Multiphase AC Arc;IEEE Transactions on Plasma Science;2019-01
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