Using Transmission Lines for Global On-Chip Communication-Reference-Cited by-同舟云学术

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Using Transmission Lines for Global On-Chip Communication

Published:2012-06 Issue:2 Volume:2 Page:183-193
ISSN:2156-3357
Container-title:IEEE Journal on Emerging and Selected Topics in Circuits and Systems
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Circuits Syst.

Author:

Carpenter Aaron,Hu Jianyun,Xu Jie,Huang Michael,Wu Hui,Liu Peng

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/5503868/6213508/06202359.pdf?arnumber=6202359

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Broadband GCPW-to-Waveguide Transition in Multi-Layer Dielectric Substrates With Modified V-Shaped and Double Patch in 270 GHz Band;IEEE Journal of Microwaves;2024-07

2. Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era;ACM Journal on Emerging Technologies in Computing Systems;2022-03-22

3. Optical Interconnects Finally Seeing the Light in Silicon Photonics: Past the Hype;Nanomaterials;2022-01-29

4. A 1000× Improvement of the Processor-Memory Gap;The Frontiers Collection;2020

5. Channel Modeling and Characterization for Wireless Networks-on-Chip Communications in the Millimeter Wave and Terahertz Bands;IEEE Transactions on Molecular, Biological and Multi-Scale Communications;2019-10

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