Tooling and procedures for hybrid integration of lasers by flip-chip technology-Reference-Cited by-同舟云学术

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Tooling and procedures for hybrid integration of lasers by flip-chip technology

Published:2020-09-15 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
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Author:

Mitchell Colin J,Li Ke,Schachler Ralph,Khokhar Ali,Chen Xia,Stankovic Stevan,Wang Xiangjun,Sessions Neil P,Grabska Katarzyna M,Thomson David J,Daedlow Christoph,Reed Graham T,Wilkinson James S

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9229482/9229650/09229661.pdf?arnumber=9229661

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding;Optics Express;2024-01-16

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