1. Technische Universität Dresden,Institute of Electronic Packaging Technology,Dresden,Germany
2. Fraunhofer Institute for Reliability and Microintegration IZM-ASSID,Institute of Electronic Packaging Technology, Technische Universität Dresden,Moritzburg,Germany
3. DuPont,Chiyodaku, Tokyo,Japan
4. Fraunhofer Institute for Reliability and Microintegration IZM,All Sillicon System Integration ASSID,Moritzburg,Germany