Research on 3D Integrated Circuit Layout Planning Model Based on Genetic Algorithm
Author:
Affiliation:
1. Zhenjiang Power Supply Branch of State Grid Jiangsu Electric Power Co., Ltd.,Zhenjiang,Jiangsu,China,212000
2. Danyang Power Supply Branch of State Grid Jiangsu Electric Power Co., Ltd.,Danyang,Liaoning,China,212300
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10414453/10414454/10414950.pdf?arnumber=10414950
Reference13 articles.
1. Three-dimensional Floorplan Representations by Using Corner Links and Partial Order
2. Three-dimensional reconstruction of integrated implosion targets from simulated small-angle pinhole images
3. Fast electromagnetic solver for interconnection lines of 3D integrated circuits based on volume integral equation;Shunchuan;Journal of Radio Science,2019
4. Detection and diagnosis of composite faults of silicon vias in 3D integrated circuits;Yuling;Semiconductor Technology,2019
5. Study on Thermal Characteristics of TSV in 3D Integrated Circuits;Zhiqing;Semiconductor Optoelectronics,2019
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