Cross-Layer Resilience in Low-Voltage Digital Systems: Key Insights-Reference-Cited by-同舟云学术

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Cross-Layer Resilience in Low-Voltage Digital Systems: Key Insights

Published:2017-11 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE International Conference on Computer Design (ICCD)
language:
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Author:

Cheng Eric,Abraham Jacob,Bose Pradip,Buyuktosunoglu Alper,Campbell Keith,Chen Deming,Cher Cheng-Yong,Cho Hyungmin,Le Binh,Lilja Klas,Mirkhani Shahrzad,Skadron Kevin,Stan Mircea,Szafaryn Lukasz,Vezyrtzis Christos,Mitra Subhasish

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8118206/8119172/08119276.pdf?arnumber=8119276

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The TETRISC SoC—A resilient quad-core system based on the ResiliCell approach;Microelectronics Reliability;2023-09

2. Active Accelerated Self-healing as a Key Design Knob for Cross-Layer Resilience;Circadian Rhythms for Future Resilient Electronic Systems;2019-06-13

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