Enhanced Defect Detection in After Develop Inspection with Machine Learning Disposition-Reference-Cited by-同舟云学术

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Enhanced Defect Detection in After Develop Inspection with Machine Learning Disposition

Published:2021-05-10 Issue: Volume: Page:
ISSN:
Container-title:2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

McLaughlin Matthew P.,Stamper Andrew,Barber Gabriel,Paduano Janice,Mennell Petra,Benn Emerson,Linnane Michael,Zwick Justin,Khatumria Chetan,Isaacson Robert L.,Hoffman Nathan,Menser Clayton

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9435607/9435648/09435721.pdf?arnumber=9435721

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Survey on ontology-based explainable AI in manufacturing;Journal of Intelligent Manufacturing;2024-02-01

2. AI/ML algorithms and applications in VLSI design and technology;Integration;2023-11

3. Machine Learning on Multiplexed Optical Metrology Pattern Shift Response Targets to Predict Electrical Properties;IEEE Transactions on Semiconductor Manufacturing;2023

4. Machine Learning Prediction Model for Automation Equipment Control in Semiconductor Manufacturing;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19

5. Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography;IEEE Transactions on Semiconductor Manufacturing;2022-08

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