Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests-Reference-Cited by-同舟云学术

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Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests

Published:2023-05-28 Issue: Volume: Page:
ISSN:
Container-title:2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)
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Author:

García-Souto José A.¹,Báez-Rivera Cindy A.¹,Erbacher Kolja²,Carrillo-Agudo Pablo¹,Ngo Ha Duong³,Acedo Pablo¹

Affiliation:

1. Universidad Carlos III de Madrid,Sensors and Instrumentation Techniques Group,Departamento de Tecnología Electrónica,Madrid,Leganés,Spain

2. Technical University of Berlin,Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

3. University of Applied Sciences,Microsystems Technologies/Microsensors,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10267916/10267866/10267950.pdf?arnumber=10267950

Reference6 articles.

1. Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

2. Design and modeling of a novel piezoresistive microphone for aero acoustic measurements in laminar boundary layers using FEM and LEM;erbacher;AIAA Advanced Testing and Measurement Techniques,2021

3. Signal conditioning design for aero-acoustic piezoelectric MEMS microphone arrays;garcía-souto,0

4. Microfabrication and characterization of dual-frequency piezoelectric micromachined ultrasonic transducers

5. Road to Acquisition: Preparing a MEMS Microphone Array for Measurement of Fuselage Surface Pressure Fluctuations

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