Author:
Bendaou Om,Bendaou Ot.,El Hami A.,Agouzoul M.
Cited by
3 articles.
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1. Study on electro-thermal coupling characteristics of GIL and it fast calculation method;2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE);2022-09-25
2. Finite element sensitivity and reliability analysis with application in thermal management of LED packages;2021 IEEE Industry Applications Society Annual Meeting (IAS);2021-10-10
3. Identification of influencing PCB design parameters on thermal performance of a QFN package;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07