135GHz CMOS / LTCC MIMO Receiver Array Tile Modules
Author:
Funder
Semiconductor Research Corporation
DARPA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9682201/9682202/09682493.pdf?arnumber=9682493
Reference19 articles.
1. A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link
2. A 143 GHz InP-Based Radio Link Characterized in Long-Term Outdoor Measurement
3. A Fully Integrated 32 Gbps 2x2 LoS MIMO Wireless Link with UWB Analog Processing for Point-to-Point Backhaul Applications
4. End-to-end 140 GHz Wireless Link Demonstration with Fully-Digital Beamformed System
5. D-band Phased-Array TX and RX Front Ends Utilizing Radio-on-Glass Technology
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1. Sub-THz U-Slot Coupled Stacked-Patch Radiating Elements for Dual-Polarized MIMO Array Antennas;2024 18th European Conference on Antennas and Propagation (EuCAP);2024-03-17
2. A 140GHz RF Beamforming Phased-Array Receiver Supporting >20dB IRR with 8GHz Channel Bandwidth at Low IF in 22nm FDSOI CMOS;2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC);2023-06-11
3. Directional Antennas for Sub-THz and THz MIMO Systems: Bridging the Gap Between Theory and Implementation;IEEE Open Journal of the Communications Society;2023
4. IC and Array Technologies for 100-300GHz Wireless;2022 IEEE Custom Integrated Circuits Conference (CICC);2022-04
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