An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration-Reference-Cited by-同舟云学术

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An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration

Published:2010-04 Issue:4 Volume:57 Page:928-938
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Chao Tzu-Yuan,Li Chun-Hsing,Chen Yang Chuan,Chen Hsin-Yu,Cheng Yu-Ting,Kuo Chien-Nan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/5437380/05420037.pdf?arnumber=5420037

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In‐Situ Observation of Atomic Diffusion at Epitaxial Al–Si Interface;physica status solidi (RRL) – Rapid Research Letters;2024-07-26

2. A review of research on RF MEMS for metaverse interactions;Journal of Micromechanics and Microengineering;2024-07-25

3. Reliability Enhancement by Doping Boron and Fluorine in Lightly Doped Drain Region of High-Voltage FinFET;IEEE Electron Device Letters;2023-06

4. Lithography process optimization to realize RDL layers on high topography wafers for heterogeneous integration;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

5. Optimization of annealing process to realize RDL layers on high topography wafer for heterogeneous integration;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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