Electrical characterization of plastic encapsulations using an alternative gate leakage test method

Author:

van Soestbergen M.,Rongen R.T.H.,Knol J.,Mavinkurve A.,Egbers J.H.,Nath S.,Zhang G.Q.,Ernst L.J.

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Cu-Al IMC degradation under high electric fields during HTOL tests;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Reliability and Failure of Microelectronic Materials;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022

3. Crevice Corrosion of Ball Bond Intermetallics of Cu and Ag Wire;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

4. Electrical and Reliability Performance of Molded Leadless Package for High-voltage Application;Procedia Manufacturing;2015

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