Stress migration and the mechanical properties of copper-Reference-Cited by-同舟云学术

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Stress migration and the mechanical properties of copper

Published: Issue: Volume: Page:
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Container-title:2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.
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Author:

Alers G.B.,Sukamto J.,Woytowitz P.,Lu X.,Kailasam S.,Reid J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9994/32106/01493058.pdf?arnumber=1493058

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