An MILP Model for Switch, DG, and Tie Line Placement to Improve Distribution Grid Reliability-Reference-Cited by-同舟云学术

An MILP Model for Switch, DG, and Tie Line Placement to Improve Distribution Grid Reliability

Published:2023-03 Issue:1 Volume:17 Page:1316-1327
ISSN:1932-8184
Container-title:IEEE Systems Journal
language:
Short-container-title:IEEE Systems Journal

Author:

Zare-Bahramabadi Majid¹^ORCID,Ehsan Mehdi¹^ORCID,Farzin Hossein²^ORCID

Affiliation:

1. Center of Excellence in Power System Management and Control, Department of Electrical Engineering, Sharif University of Technology, Tehran, Iran

2. Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering,Computer Networks and Communications,Computer Science Applications,Information Systems

Link

http://xplorestaging.ieee.org/ielx7/4267003/10051137/09774995.pdf?arnumber=9774995

Reference35 articles.

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