Design-for-Recovery Techniques for Combating Chip Aging Issues
Author:
Affiliation:
1. University of Michigan - Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University,Shanghai,China
Funder
Shanghai Jiao Tong University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856710.pdf?arnumber=9856710
Reference10 articles.
1. Modeling and Testing of Aging Faults in FinFET Memories for Automotive Applications
2. Ml-based aging monitoring and lifetime prediction of iot devices with cost-effective embedded tags for edge and cloud operability;shamshiri;IEEE Internet of Things Journal,2021
3. OldSpot: A Pre-RTL Model for Fine-Grained Aging and Lifetime Optimization
4. Deep Healing: Ease the BTI and EM Wearout Crisis by Activating Recovery
5. Modeling and experimental demonstration of accelerated self-healing techniques;guo;2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC),2014
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1. Scheduling Active and Accelerated Recovery to Combat Aging in Integrated Circuits;2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS);2022-08-07
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