Development and Application of Electroplating Copper Products with Low or Zero Internal Stress
Author:
Affiliation:
1. Suzhou Shinhao Materials LLC,Suzhou,Jiangsu,China
2. Umicore Galvanotechnik GmbH,Schwaebisch Gmuend,Germany,73525
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856842.pdf?arnumber=9856842
Reference4 articles.
1. On the Way to understand the Warpage in 8? Taiko Semiconductor Wafers for Power Electronics Applications (Si and SiC);vinciguerra;2021 22nd International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),0
2. Improvement of substrate and package warpage by copper plating process optimization
3. Ultra-thin wafer technology and applications: A review
4. Stress and strain within photovoltaic modules using the finite element method: A critical review;philippe;Renewable and Sustainable Energy Reviews,2021
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